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Phoenix Contact 1043731

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Phoenix Contact 1043731

Model Number : 1043731

Stock : 25000

Contact Material : Copper alloy

MOQ : 250

Number of Rows : 2

Brand Name : 1043731

Description : Copper alloy 2 -55℃~+125℃ Surface Mount,Vertical 1.2mm SMD Headers, Male Pins RoHS

Mounting Type : Surface Mount,Vertical

Delivery Time : 16-30周

Packaging Details : SMD

Operating Temperature : -55℃~+125℃

Row Spacing : 1.2mm

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Product Overview

The PHOENIX CONTACT FP 0,8/ 12-MV-SH 2,65 is a shielded SMD male connector designed for reliable and high-quality signal transmission. Featuring gold-plated contacts for stable long-term transfer quality and the robust ScaleX contact system for high tolerance compensation and contact protection, this connector offers flexible device design with various stack heights. It is suitable for applications requiring dependable mechanical and electrical connections in a compact SMD form factor.

Product Attributes

Brand: PHOENIX CONTACT
Product Range: FP 0,8/...-MV-SH 2,65
Plug-in System: FINEPITCH 0,8 mm shielded
Type of Contact: Male connector
Mounting Type: SMD soldering
Pin Layout: Linear pad geometry
Number of Levels: 2
Housing Color: Black (9005)
Insulating Material: LCP
Insulating Material Group: IIIa
CTI according to IEC 60112: 150
Flammability rating according to UL 94: V0
Contact Material: Cu alloy
Surface Characteristics: Selective coating
Metal surface contact area (top layer): Gold (Au)
Metal surface contact area (middle layer): Nickel (Ni)
Metal surface soldering area (top layer): Tin (Sn)
Metal surface soldering area (middle layer): Nickel (Ni)
WEEE/RoHS-compliant: Yes
Free of whiskers according to IEC 60068-2-82/ JEDEC JESD 201: Yes
ESD level (D) electrostatically conductive: Yes
Approvals: EAC, cULus Recognized

Technical Specifications

Specification	Value
Number of positions	12
Pitch	0.8 mm
Nominal current at 20 C	1.7 A (80-pos.)
Test voltage	500 V AC
Contact resistance	≤15 mΩ (IEC 60512-2-1:2002-02)
Insulation resistance	≥ 5 GΩ (IEC 60512-3-1:2002-02)
Length [l]	6.1 mm
Width [w]	8.7 mm
Height [h]	7.75 mm
Height (without solder pin)	7.15 mm
Coplanarity	≤ 0.1 mm
Contact cover	0.8 mm
Overlap length	1.5 mm
Medium offset (longitudinal and transverse)	± 0.7 mm
Angular tolerance (longitudinal)	± 2 °
Angular tolerance (transverse)	± 4 °
Stack height	7.5 mm
Stack height (tolerance with FP 0,8/...-FV-SH 4,85)	+1.5 mm (10.5 mm)
Stack height (tolerance with FP 0,8/...-FV-SH 7,85)	+1.5 mm (10.5 mm)
Packaging type	24 mm wide tape
Pieces per package	250
Tape width [W]	24.4 mm
Coil diameter [A]	330 mm
Coil overall dimension [W2]	30.4 mm
Outer packaging type	Transparent-Bag
Process	Reflow soldering
Moisture Sensitive Level (MSL)	1
Classification temperature Tc	260 °C
Ambient temperature (storage/transport)	-40 °C ... 70 °C
Ambient temperature (assembly)	-5 °C ... 100 °C
Ambient temperature (operation)	-55 °C ... 125 °C
Air clearances and creepage distances (min.)	0.25 mm
Service life	500 Insertion/withdrawal cycles
Performance level	1

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