| Salt Spray Test (EEZEWI) | Mated connectors to 35+/-2C .Humidity:85%(R.H). PH value:6.5~7.2 and 5+/-1% salt condition for 24hours. After test, rinse the sample with water and recondition the room temperature for 1 hour test CR and IR. | EIA-364-26B | | (1) contact Resistance: 100 m Max.
(2) contact Resistance: 500 MQ MIN.
(3) Appearance shall no rust, oxidation, corrosion and other undesirable phenomena. |
| Solder ability | Solder Temperature: 245+/-3C
Immersion Duration: 3+0.5 sec.
Flux: RMA 25% | | | Wet Solder Coverage: 95 % Min. |
| Resistance to soldering heat | In case of solder iron (2 time)
Temperature: 350C
Time: 5+/-1s | | | Should not have any flaw, scratch and crack. |
| IR-reflow | Peak temperature 260C Max, 10 sec or more.
Duration: 2 cycles
Lead-Free Solder: Sn96.5Ag3Cu1.5 | MIL-STD-202G method 210F | | Should not have any flaw, scratch and crack.
No visual damage to insulator. |
| Insertion/Extraction force | Measure the module insertion extraction force at 253mm/min. | EIA364-13 | | 2.2N~22.2N |
| Durability | Number of test cycle is 5000 minimum and cycles rate is 100 50 cycles per hour. | EIA 364-B | | Contact resistance: 100 m Max. Change of 40 m Max. after testing.
Insulation Resistance: 100 MQ min.
No physical damage to Connector shall occur. |
| Contact retention force | Apply axial pull out force on the Terminal assembled in the housing at a rate of 25+3mm min. | | | 100 N |
| Mechanical Shock | Accelerated Velocity: 50 G (490 m/s)
Waveform: Semi Sine
Duration: 11 m sec.
No of Shocks: 6/dir., 3 axis (Total of 18 Shocks) | EIA364-27 | | (1) contact Resistance: 100 m Max.
(2) contact Resistance: 500 MQ MIN.
(3) No electrical discontinuity greater than 100nsec. shall occur. |
| Vibration | Frequency Range: 10-2000
Total Amplitude: 2m/s.
Duration: 2.5 hours 3 axes | IEC 60512-6-4 | | (1) contact Resistance: 100 m Max.
(2) contact Resistance: 500 MQ MIN.
(3) No electrical discontinuity greater than 100nsec. shall occur. |
| High Temperature | The contact and card is exposed in the heat chamber 90C for 96 hours. After test stored at room temperature for 1 hours test CR and IR. | IEC 60512-11-3 | | (1) contact Resistance: 100 m Max.
(2) contact Resistance: 3500 MQ MIN.
Function and performance shall be as specified. Not to change for physical appearance. |
| Low Temperature | The contact and card is exposed in the cold chamber -25C for 96 hours. After test stored at room temperature for 1 hours test CR and IR. | IEC 60512-11-3 | | (1) contact Resistance: 100 m Max.
(2) contact Resistance: 500 MQ MIN.
Function and performance shall be as specified. Not to change for physical appearance. |
| Humidity resistance | Steady state 40C,90~95%RH for 96H with mate connectors * After test stored at room temperature for 1 hours test CR and IR. | IEC 60512-11-3 | | (1) contact Resistance: 100 m Max.
(2) contact Resistance: 500 MQ MIN.
Function and performance shall be as specified. Not to change for physical appearance. |
