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XUNPU TF-128-ARP9

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XUNPU TF-128-ARP9

Card Connection Mode : Push-Pull

Card Type : MicroSD Card (TF Card)

Brand Name : TF-128-ARP9

Packaging Details : SMD

Delivery Time : 12-17工作日

Connector Type : Connector and Ejector

Operating Temperature : -25℃~+60℃

MOQ : 2500

Model Number : TF-128-ARP9

Description : Micro SD card (TF card) Connector and Ejector Push-Pull Surface Mount

Stock : 5000

Height Above Board : 1.15mm

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Product Overview

This product is a Micro SD H1.15 Card Connector designed for various applications. It features a high-temperature thermoplastic housing (LCP MG350) in black, UL 94V-0 rated. The connector is ROHS compliant and meets ELV 2000/53/EC directives. It is suitable for use with metal parts thicker than 0.15mm and has undergone rigorous testing for mating cycles and environmental conditions. The product also includes card detection and switch functionalities.

Brand

Unspecified

Origin

DongGuan XunPu Electronics Co,Ltd

Material

Housing: High Temperature Thermaplastic (LCP MG350), Contact: Phosphor Bronze (C5210R-SH), Cover: SUS304-H

Color

Black

Certifications

ROHS Compliant, ELV 2000/53/EC

Package Type

TF Card Connector

Model/Part Number

TF-128-ARP9

Technical Specifications

SpecificationValueUnitNotes
Contact Current Rating0.5Amperes
Dielectric Withstanding Voltage250V r.m.s
Insulation Resistance1000Megohms Minimum At DC 500V
Contact Resistance100m Maximum
Mating Cycles5,000Cycles
Operating Temperature-25 to +60C
Housing MaterialHigh Temperature Thermaplastic (LCP MG350)Color Black UL 94V-0
Contact MaterialPhosphor Bronze (C5210R-SH)T=0.12mm
Cover MaterialSUS304-HT=0.10mm
Contact Plating (Contact Area)2" MinGold
Contact Plating (Middle)8 minPd=Ni
Contact Plating (Solder Area)1 MinGold
Contact Plating (Underplating)80 MinNi overall
Cover Plating (Underplating)30U" MinNi overall
Cover Plating (Solder Area)1 MinGold
Pitch (Connector Center)0.70mm
Pitch (Card Detection)0.70mm
Pitch (Card Detection)0.70mm
Card Detection FunctionYesWhen become a card
Switch FunctionYes
ComplianceRoHS Directive 2002/95/EC and ELV 2000/53/EC
Specification ComplianceTaisol HF WD-3-I-091
Recommended Metal Thickness> 0.15mmFor solderability confirmation

Pin Definition

PIN NO.NAMETYPEDESCRIPTION
1CD/DAT2I/O/PPCARD DETECT DATE LINE(BIT2)
2CD/DAT3I/O/PPCARD DETECT DATE LINE(BIT3)
3CDI/O/PPCOMMAND RESPONSE
4VODSUPPLY VOLTAGE
5CLKCLOCK
6VssSUPPLY VOLTAGE GROUND
7DAT0I/O/PPDATE LINE(BMO)
8DAT1I/O/PPDATE LINE(DITT)
9-12GND

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