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TE Connectivity 3-2199250-3

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TE Connectivity 3-2199250-3

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Stock : 4400000

Packaging Details : -

MOQ : 44000

Brand Name : 3-2199250-3

Delivery Time : 25-42 weeks

Description : RFI and EMI - Contacts, Fingerstock and Gaskets RoHS

Model Number : 3-2199250-3

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Product Overview

This specification covers the requirements for product performance, test methods, and quality assurance provisions of the TE Connectivity Low Force Scalable Spring Finger.

Application: Used in electronic components.

Brand TE Connectivity
Origin Shanghai, China
Document ID 108-115061-1
Specification Type A Type B & C Unit
Material SUS301 Copper alloy
Under Plating Ni 2m MIN.
Contact Area Plating Gold 0.5m MIN.
Soldering Area Plating Gold Flash
Voltage Rating 15 Max. V
Current Rating 2.0 A
Operating Temperature Range -30 to 85 C
Storage Temperature Range -5 to 85 C
Storage Humidity Range 15 to 70 %RH
Test Description Requirement Unit
Low level contact resistance (Initial) 75 Max. (Type A) m
Low level contact resistance (Initial) 25 Max. (Type B/C) m
Low level contact resistance (Final) 100 Max. (Type B/C) m
Temperature rise 30 Max. increase of contact temperature C
Damp heat Contact resistance 50 Max. (Cu alloy) / 100 Max. (SST) m
Vibration Discontinuity <1 s
Vibration Contact resistance 50 Max. m
Shock Discontinuity <1 s
Shock Contact resistance 50 Max. m
Solderability 95% Min. solder coverage
Thermal shock Contact resistance 50 Max. (Cu alloy) / 100 Max. (SST) m
Contact force at maximum working height (minimum deflection) 0.2 Min. N
Contact force at minimum working height (maximum deflection) 1.2 Max. N
Durability (Life cycle) Contact resistance 50 Max. m
Durability (Spring dynamic test) Contact resistance 50 Max. m
Peeling Strength 3 (Type A&B) / 9 (Type C) N
Push Strength 10 Min. N

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