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TE Connectivity 2199337-5

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TE Connectivity 2199337-5

MOQ : 1

Description : -30℃~+85℃ Push-Pull 1.2mm Connector and Ejector MicroSIM Card PC Card Sockets RoHS

Stock : 18953

Operating Temperature : -30℃~+85℃

Packaging Details : -

Card Connection Mode : Push-Pull

Brand Name : 2199337-5

Height Above Board : 1.2mm

Delivery Time : 1工作日

Price : ¥7.8352 (1 - 9); ¥6.3941 (10 - 29); ¥5.6061 (30 - 99); ¥4.7239 (100 - 499); ¥4.3364 (500 - 999); ¥4.1581 (1000+)

Card Type : MicroSIM Card

Model Number : 2199337-5

Connector Type : Connector and Ejector

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Product Overview

This 3FF SIM, Push-Pull Type connector is designed for 8 positions with 8 loaded positions, handling signal applications. It features a robust thermoplastic housing and a reliable push-pull ejector mechanism. The connector is surface mountable to PCBs with a 2.54 mm [.1 in] centerline pitch. It is compatible with 3FF SIM cards and offers a durability rating of 5000 cycles. The operating temperature range is -30 to 85 C [-22 to 185 F].

Product Type3FF SIM

Connector TypeSIM Card Connector

Actuation TypePush-Pull

Number of Positions8 Position

Number of Loaded Positions8 Loaded Positions

Termination MethodSurface Mount

Housing MaterialThermoplastic

Centerline (Pitch)2.54 mm [.1 in]

Primary Product ColorBlack

Ejector TypePush-Pull

Packaging MethodTape & Reel, Reel

Packaging Quantity2000

Profile Height from PCB1.18 mm [.046 in]

Durability Rating5000 Cycles

Contact Base MaterialCopper Alloy

Contact Mating RetentionWithout

Card Detection SwitchWith

Card Insertion StyleNormal Insertion

Card StopWith

Compatible Card3FF SIM

Operating Temperature Range-30 85 C [-22 185 F]

UL Flammability RatingUL 94V-0

EU RoHS ComplianceCompliant

EU ELV ComplianceCompliant

China RoHS DirectiveMIIT Order No 32, 2016

REACH RegulationDoes not contain REACH SVHC

Halogen ContentLow Bromine/Chlorine - Br and Cl < 900 ppm per homogenous material. Also BFR /CFR/PVC Free

Solder Process CapabilityReflow solder capable to 260C

TE Internal #	Product Type	Actuation Type	Positions	Loaded Positions	Contact Current Rating (Max)	Operating Temperature Range	Packaging Method	Packaging Quantity	Profile Height from PCB	Durability Rating	Housing Material	Centerline (Pitch)	Termination Method	UL Flammability Rating	RoHS Compliance	ELV Compliance	Halogen Content	Solder Process Capability
2199337-5	3FF SIM	Push-Pull	8	8	1 A	-30 85 C [-22 185 F]	Tape & Reel, Reel	2000	1.18 mm [.046 in]	5000 Cycles	Thermoplastic	2.54 mm [.1 in]	Surface Mount	UL 94V-0	Compliant	Compliant	Low Bromine/Chlorine - Br and Cl < 900 ppm per homogenous material. Also BFR /CFR/PVC Free	Reflow solder capable to 260C

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