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TE Connectivity 2-5499206-1

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TE Connectivity 2-5499206-1

MOQ : 648

Brand Name : 2-5499206-1

Description : Through Hole FFC, FPC (Flat Flexible) Connector Housings RoHS

Model Number : 2-5499206-1

Packaging Details : Through Hole

Stock : 64800

Delivery Time : 25-42周

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Product Overview

This specification covers performance, tests, and quality requirements for AMP-LATCH* universal and low profile, and IDC standard and low profile .100 X .100 inch grid headers, right angle and vertical assemblies. The product is designed to meet electrical, mechanical, and environmental performance requirements.

Specification	Requirement	Procedure
Insulation resistance	5000 megohms minimum initial. 1000 megohms minimum final.	EIA-364-21. 500 volts DC, 2 minute hold. Test between adjacent contacts of unmated specimens.
Withstanding voltage	One minute hold with no breakdown or flashover. 1000 volts AC at sea level.	EIA-364-20, Condition I. Test between adjacent contacts of unmated specimens.
Solderability	Solderable area shall have minimum of 95% solder coverage.	TE Spec 109-11-1. Subject contacts to solderability for specimens with tin-lead plated soldertails. TE Spec 109-11-11. Subject contacts to solderability for specimens with lead-free tin plated soldertails.
Component resistance to wave soldering	See Note.	TE Spec 109-202, Condition A. 240C for specimens with tin-lead plated soldertails. TE Spec 109-202, Condition B. 265C for specimens with lead-free tin plated soldertails.
Contact retention	Post shall not dislodge from normal position.	EIA-364-29, Method A. Apply axial load of 2 pounds to contacts and hold for 6 seconds. See Figure 3.
Thermal shock	See Note.	EIA-364-32, Test Condition II. Subject unmated specimens to 5 cycles between -65 and 105C with 30 minute dwells at temperature extremes.
Humidity/temperature cycling	See Note.	EIA-364-31, Method III. Subject unmated specimens to 10 cycles (10 days) between 25 and 65C at 80 to 100% RH with cold shock. Shall meet visual requirements, show no physical damage and shall meet requirements of NOTE additional tests as specified in Test Sequence in Figure 2.

Test or Examination	Test Group	Test Sequence
Examination of product	1,3,5	1,3
Insulation resistance	2,6	1,8
W ithstanding voltage	3,7	2
Solderability	2	Component resistance to wave soldering
Contact retention	4	Thermal shock
Humidity/temperature cycling	5

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